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        參數(shù)資料
        型號(hào): MSP430F2370IRHAT
        廠商: Texas Instruments
        文件頁(yè)數(shù): 27/65頁(yè)
        文件大?。?/td> 0K
        描述: IC MCU 16BIT 32K FLASH 40-QFN
        產(chǎn)品培訓(xùn)模塊: The Ultra-Low Power MSP430
        MSP430 Overview
        MSP430 Design Tools
        MSP430 Peripherals
        MSP430x2xx/4xx and Wireless Overview
        Portable Medical Solutions with MSP430
        MSP430 for Utility Metering Solutions
        MSP430: How to JTAG
        MSP430, How To Use the Clock System
        Grace Software Graphical User Interface
        MCU Overview
        Driver Library
        MSP430Ware Overview
        標(biāo)準(zhǔn)包裝: 1
        系列: MSP430F2xx
        核心處理器: RISC
        芯體尺寸: 16-位
        速度: 16MHz
        連通性: I²C,IrDA,LIN,SCI,SPI,UART/USART
        外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,PWM,WDT
        輸入/輸出數(shù): 32
        程序存儲(chǔ)器容量: 32KB(32K x 8 + 256B)
        程序存儲(chǔ)器類型: 閃存
        RAM 容量: 2K x 8
        電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.6 V
        數(shù)據(jù)轉(zhuǎn)換器: 斜率 A/D
        振蕩器型: 內(nèi)部
        工作溫度: -40°C ~ 85°C
        封裝/外殼: 40-VFQFN 裸露焊盤(pán)
        包裝: 標(biāo)準(zhǔn)包裝
        產(chǎn)品目錄頁(yè)面: 712 (CN2011-ZH PDF)
        其它名稱: 296-21750-6
        MSP430F23x0
        SLAS518E
        – AUGUST 2006 – REVISED AUGUST 2011
        Crystal Oscillator LFXT1, High-Frequency Mode
        (1)
        PARAMETER
        TEST CONDITIONS
        VCC
        MIN
        TYP
        MAX
        UNIT
        LFXT1 oscillator crystal
        fLFXT1,HF0
        XTS = 1, XCAPx = 0, LFXT1Sx = 0
        1.8 V to 3.6 V
        0.4
        1
        MHz
        frequency, HF mode 0
        LFXT1 oscillator crystal
        fLFXT1,HF1
        XTS = 1, XCAPx = 0, LFXT1Sx = 1
        1.8 V to 3.6 V
        1
        4
        MHz
        frequency, HF mode 1
        1.8 V to 3.6 V
        2
        10
        LFXT1 oscillator crystal
        fLFXT1,HF2
        XTS = 1, XCAPx = 0, LFXT1Sx = 2
        2.2 V to 3.6 V
        2
        12
        MHz
        frequency, HF mode 2
        3 V to 3.6 V
        2
        16
        1.8 V to 3.6 V
        0.4
        10
        LFXT1 oscillator logic-level
        fLFXT1,HF,logic
        square-wave input
        XTS = 1, XCAPx = 0, LFXT1Sx = 3
        2.2 V to 3.6 V
        0.4
        12
        MHz
        frequency, HF mode
        3 V to 3.6 V
        0.4
        16
        XTS = 1, XCAPx = 0, LFXT1Sx = 0,
        2700
        fLFXT1,HF = 1 MHz, CL,eff = 15 pF
        Oscillation allowance for HF
        XTS = 1, XCAPx = 0, LFXT1Sx = 1,
        OAHF
        crystals (see Figure 17 and
        800
        fLFXT1,HF = 4 MHz, CL,eff = 15 pF
        XTS = 1, XCAPx = 0, LFXT1Sx = 2,
        300
        fLFXT1,HF = 16 MHz, CL,eff = 15 pF
        Integrated effective load
        CL,eff
        XTS = 1, XCAPx = 0(3)
        1
        pF
        capacitance, HF mode(2)
        XTS = 1, XCAPx = 0,
        Measured at P2.0/ACLK,
        40
        50
        60
        fLFXT1,HF = 10 MHz
        Duty cycle, HF mode
        2.2 V/3 V
        %
        XTS = 1, XCAPx = 0,
        Measured at P2.0/ACLK,
        40
        50
        60
        fLFXT1,HF = 16 MHz
        fFault,HF
        Oscillator fault frequency (4)
        XTS = 1, XCAPx = 0, LFXT1Sx = 3(5)
        2.2 V/3 V
        30
        300
        kHz
        (1)
        To improve EMI on the XT2 oscillator the following guidelines should be observed:
        (a) Keep the trace between the device and the crystal as short as possible.
        (b) Design a good ground plane around the oscillator pins.
        (c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
        (d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
        (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
        (f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
        (g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
        signal is no longer required for the serial programming adapter.
        (2)
        Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, it is
        recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should
        always match the specification of the used crystal.
        (3)
        Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
        (4)
        Frequencies below the MIN specification set the fault flag, frequencies above the MAX specification do not set the fault flag, and
        frequencies in between might set the flag.
        (5)
        Measured with logic-level input frequency, but also applies to operation with crystals.
        Copyright
        2006–2011, Texas Instruments Incorporated
        33
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